Тип публикации: статья из журнала
Год издания: 2024
Идентификатор DOI: 10.1134/S1063784224070041
Ключевые слова: thin films, transmission electron microscopy, Energy dispersion spectroscopy, Mass transfer mechanisms
Аннотация: Study of the mechanisms of the solid-state reactions in Sn/Fe/Cu thin films is interesting both from a fundamental point of view and from a view of the importance of emerging intermetallics in the technology of solder joints and thin-film lithium-ion batteries. By the integrated approach, including both X-ray phase analysis and locПоказать полностьюal elemental analysis of the cross-sections of the films, the phase composition and the mutual arrangement of phases were studied, at various stages of the solid-state reaction occurring at different temperatures. The observed sequence of the appearing phases differs significantly from the expected one if the mass transfer took place by a volume diffusion through the forming layers.
Журнал: Technical Physics
Выпуск журнала: Т.69, №7
Номера страниц: 1893-1897
ISSN журнала: 10637842
Место издания: Санкт-Петербург
Издатель: Pleiades Publishing, Ltd. (Плеадес Паблишинг, Лтд)