Тип публикации: статья из журнала

Год издания: 2022

Идентификатор DOI: 10.21883/pss.2022.14.54350.139

Аннотация: <jats:p> The study of the formation of the Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic compound in Sn(55 nm)/Cu(30 nm) thin bilayer films was carried out directly in the column of a transmission electron microscope (electron diffraction mode) by heating the film sample from room temperature to 300<jats:sup>o</jatПоказать полностьюs:sup>C and recording the electron diffraction patterns. The thin films formed as a result of a solid state reaction were monophase and consisted of the eta-Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> hexagonal phase. The temperature range for the formation of the eta-Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> phase was determined. The estimate of the effective interdiffusion coefficient of the reaction suggests that the main mechanism for the formation of the Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic is diffusion along the grain boundaries and dislocations. Keywords: thin films, Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic compound, transmission electron microscopy, electron diffraction. </jats:p>

Журнал: Physics of the Solid State

Выпуск журнала: Т.64, №14

Номера страниц: 2456

ISSN журнала: 10637834

Издатель: Ioffe Institute Russian Academy of Sciences

• Bykova L. E. (Kirensky Institute of Physics, Federal Research Center KSC SB, Russian Academy of Sciences, Krasnoyarsk, Russia)
• Zharkov S. M. (Siberian Federal University, Krasnoyarsk, Russia)
• Myagkov V. G. (Kirensky Institute of Physics, Federal Research Center KSC SB, Russian Academy of Sciences, Krasnoyarsk, Russia)
• Balashov Yu. Yu. (Kirensky Institute of Physics, Federal Research Center KSC SB, Russian Academy of Sciences, Krasnoyarsk, Russia)
• Patrin G. S. (Siberian Federal University, Krasnoyarsk, Russia)

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