Тип публикации: статья из журнала (материалы конференций, опубликованные в журналах)
Год издания: 2005
Ключевые слова: Copper-based composite, Electrical contact material, Microstructure, Performance, Arc erosion, Micro-cracks, Copper compounds, Electric commutation, Failure (mechanical), Grain boundaries, Grain size and shape, Metallic matrix composites, Powder metallurgy, Scanning electron microscopy, Electric contacts
Аннотация: Dependence of microstructure upon transfer stability of the powder-metallurgy copper-diamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and meПоказать полностьюchanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20-50?m and 10-20 ?m for niobium particles in these tests. © 2005 Trans Tech Publications, Switzerland.
Журнал: (2 November 2004 through 5 November 2004, Beijing
Выпуск журнала: Vol. 475-479
Номера страниц: 869-872