Estimation of the thermal gap when soldering waveguide elements : доклад, тезисы доклада


Тип публикации: доклад, тезисы доклада, статья из сборника материалов конференций

Конференция: Modernization, Innovations, Progress: Advanced Technologies in Material Science, Mechanical and Automation Engineering (MIP-III 2021); Krasnoyarsk; Krasnoyarsk

Год издания: 2021

Идентификатор DOI: 10.1088/1757-899X/1155/1/012020

Аннотация: This paper proposes a method for determining the required gap between the elements of the waveguide path during its assembly by soldering. The need for a thermal gap is defined by difference in mass and dimensional parameters of the elements to be connected, due to which a significant no uniformity of heating and thermal deformatioПоказать полностьюns occur. The no uniformity of thermal deformations leads to jamming of one element in another, therefore, the heating time and the size of the thermal gap are need to be determined. The diameter of the solder wire is determined according to the size of the thermal gap and the required fillet of the soldered seam. The performed numerical calculations of the stress state of the obtained soldered seam showed the absence of stress concentration. Mechanical tests have confirmed the high strength of soldered seam.

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Журнал: IOP Conference Series: Materials Science and Engineering

Выпуск журнала: Volume 1155

Номера страниц: 12020

Место издания: Krasnoyarsk

Издатель: IOP Publishing Ltd


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